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Master Bond adhesives

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Bakelite® EP 8413 Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled

Material Notes: Epoxy molding compound, inorganically mica filled, good heat resistance, high viscosity flow characteristics.

Applications: H4 and H7 lamp sockets

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Physical PropertiesOriginal ValueComments
Density 2.05 g/ccISO 1183
Apparent Bulk Density 1.00 g/ccISO 60
Linear Mold Shrinkage 0.0025 cm/cmCompression Molding. Post Shrinkage = 0%.; ISO 2577
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 30.0 MPaISO 527 - 1/2
Tensile Modulus 20500 MPaISO 527 - 1/2
Flexural Strength 60.0 MPaISO 178
Flexural Modulus 18500 MPaISO 178
Compressive Strength 140 MPaISO 604
Charpy Impact Unnotched 2.00 kJ/m²ISO 179-1 eU
Charpy Impact, Notched 1.40 kJ/m²ISO 179-1eA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cm
Surface Resistance 1.00e+12 ohm
Dielectric Constant 5.0
@Frequency 100 Hz
Dielectric Strength 19.0 kV/mm
@Thickness 1.00 mm
IEC 60243-P1
Dissipation Factor 0.030
@Frequency 100 Hz
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 8.0 MPa 145 °CISO 75-2
 
Descriptive Properties
Water absorption (mg)624h / 23°C

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