Appearance: Black Cure: Heat cure Product Benefits: - Snap curable
- Fast flow
- Passes NASA outgassing
Application: Underfill Typical Application: Flex applications LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap. LOCTITE ECCOBOND FP4531 passes NASA outgassing standards. Information provided by Loctite® |