Parker Chomerics CHO-BOND® SV712 Conductive Epoxy

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Parker Chomerics CHO-BOND® SV712 Conductive Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV712 die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleed out on a variety of substrates and metallizations. Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	3.00 - 3.60 g/cc
Volatile Organic Compounds (VOC) Content	0.00 g/l
Solubility in Water	0.00 %	Insoluble
Thickness	1.00 mil	Recommended

Mechanical Properties	Original Value	Comments
Shear Strength	>= 1100 psi	Lap
	>= 4800 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.00040 ohm-cm	DC

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-45.0 °C
Flash Point	>= 200 °F

Processing Properties	Original Value	Comments
Cure Time	0.500 hour @Temperature 150 °C
	1.00 hour @Temperature 125 °C
Shelf Life	12.0 Month @Temperature -40.0 °C

Component Elements Properties	Original Value	Comments
Silver, Ag	60 - 85 %

Descriptive Properties
Amine Compound Proprietary wt. % Max	5
Binder	Epoxy
Consistency	Thixotropic Paste
Epoxy Resin, wt %	15 - 25
Filler	Ag
Mix Ratio	1-part
o-Cresyl glycidyle ether wt. % Max	10
Work Life	4 weeks

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PCHOME061 / 28283

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