Henkel Loctite® ECCOBOND FP4470 Epoxy

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Henkel Loctite® ECCOBOND FP4470 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat cure Product Benefits: High purity 260ºC reflow capability for Pb-free applications Green product Excellent flow properties Application: Encapsulant Typical Package Application: BGA, Chip scale packages, PBGA and Full arrays on LTCC LOCTITE ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.80 g/cc
Filler Content	75 %
Brookfield Viscosity	42000 cP	Spindle 6, speed 10 rpm

Mechanical Properties	Original Value	Comments
Flexural Strength	137 MPa @Temperature 25.0 °C	ASTM D790
Flexural Modulus	600 MPa @Temperature 240 °C	ASTM D790
	12700 MPa @Temperature 25.0 °C	ASTM D790

Electrical Properties	Original Value	Comments
Volume Resistivity	5.00e+16 ohm-cm	IEC 60093
Dielectric Constant	3.5 @Frequency 1e+6 Hz
Dissipation Factor	0.010 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
CTE, linear	18.0 µm/m-°C @Temperature 40.0 - 80.0 °C	Cured, Below Tg
	65.0 µm/m-°C @Temperature 170 - 210 °C	Cured, Above Tg
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-65.0 °C
Glass Transition Temp, Tg	148 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min @Temperature 125 °C	+ 90 minutes @ 165°C
Gel Time	12.0 min @Temperature 121 °C
Shelf Life	9.00 Month @Temperature -40.0 °C

Descriptive Properties
Extractable Ionic Content (ppm)	<2	Cured, Chloride (Cl-)
	<2	Cured, Sodium (Na+)
	1	Cured, Potassium (K+)
Pot Life	3 days

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PLOCT5091 / 255302

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