LNP THERMOCOMP DF002FV compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Good Surface Aesthetics and Wide Processing Window. Features: Aesthetics and Appearance,High Stiffness,Laser Direct Structuring,Circuit Solution Information provided by SABIC |