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Röchling Durostone® CFR767 PBC Solder Pallet Material
Categories: Polymer; Thermoset

Material Notes: Flux Resistant. Used for PCB board assembly, including SMT reflow and wave soldering. Excellent mechanical properties at high temperatures, including the lead-free process. Low thermal conductivity, excellent machinability, and good resistance to chemicals in flux.

Information provided by Röchling.

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Physical PropertiesMetricEnglishComments
Density 1.80 g/cc0.0650 lb/in³
Water Absorption <= 0.20 %<= 0.20 %
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity  10.0 GPa
@Temperature 185 °C
1450 ksi
@Temperature 365 °F
 14.0 GPa
@Temperature 150 °C
2030 ksi
@Temperature 302 °F
 18.0 GPa
@Temperature 23.0 °C
2610 ksi
@Temperature 73.4 °F
Flexural Strength  150 MPa
@Temperature 185 °C
21800 psi
@Temperature 365 °F
3 point support
 260 MPa
@Temperature 150 °C
37700 psi
@Temperature 302 °F
3 point support
 380 MPa
@Temperature 23.0 °C
55100 psi
@Temperature 73.4 °F
3 point support
 
Electrical PropertiesMetricEnglishComments
Surface Resistance 1e+05 - 1.00e+9 ohm1e+05 - 1.00e+9 ohm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 11.0 µm/m-°C
@Temperature 30.0 - 200 °C
6.11 µin/in-°F
@Temperature 86.0 - 392 °F
Thermal Conductivity 0.250 W/m-K1.74 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 300 °C
@Time 10.0 - 20.0 sec
572 °F
@Time 0.00278 - 0.00556 hour
 
Descriptive Properties
ColorBrown
Standard Operating Temperature300°C

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