Copper Alloy, UNS C64790, H02 Temper, Flat Products

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Copper Alloy, UNS C64790, H02 Temper, Flat Products
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: 1/2 Hard Fabrication Properties: Excellent Suitability – Soldering; Good Suitability – Capacity for Being Cold Worked, Capacity for Being Hot Formed Common Fabrication Processes: Forming and Bending; Stamping
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Physical Properties	Metric	English	Comments

Density	8.86 g/cc	0.320 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Vickers	>= 250 @Load 3.00 kg	>= 250 @Load 6.62 lb
Tensile Strength	779 - 848 MPa	113000 - 123000 psi
	820 MPa	119000 psi	Typical
Tensile Strength, Yield	717 - 800 MPa	104000 - 116000 psi	0.2% Offset
	758 MPa	110000 psi	0.2% Offset, Typical
Elongation at Break	>= 10 %	>= 10 %
Tensile Modulus	132 GPa	19100 ksi
Modulus of Rigidity	49.5 GPa	7180 ksi	Calculated
Poissons Ratio	0.33	0.33

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.00000450 ohm-cm	0.00000450 ohm-cm	38% IACS

Thermal Properties	Metric	English	Comments
CTE, linear	17.5 µm/m-°C @Temperature 20.0 - 300 °C	9.70 µin/in-°F @Temperature 68.0 - 572 °F
Thermal Conductivity	12.5 W/m-K	87.0 BTU-in/hr-ft²-°F
Melting Point	1067 - 1076 °C	1953 - 1969 °F
Solidus	1067 °C	1953 °F
Liquidus	1076 °C	1969 °F

Component Elements Properties	Metric	English	Comments
Chromium, Cr	0.050 - 0.50 %	0.050 - 0.50 %
Copper, Cu	92 - 96.5 %	92 - 96.5 %	As Balance
Iron, Fe	<= 0.10 %	<= 0.10 %
Lead, Pb	<= 0.050 %	<= 0.050 %
Magnesium, Mg	0.050 - 0.30 %	0.050 - 0.30 %
Manganese, Mn	<= 0.10 %	<= 0.10 %
Nickel, Ni	2.5 - 4.5 %	2.5 - 4.5 %
Silicon, Si	0.60 - 1.2 %	0.60 - 1.2 %
Tin, Sn	0.050 - 0.50 %	0.050 - 0.50 %
Zinc, Zn	0.30 - 0.80 %	0.30 - 0.80 %

References for this datasheet.

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MC64790x1 / 292252

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