Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill

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Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	STAYCHIP™ 3100 is an aromatic amine-cured epoxy underfill, designed for exceptional adhesion to common solder-mask and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after accelerated environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Features: Excellent Reliability in Thermal Cycling Excellent Reliability in JEDEC testing (Level 3/ 260°C on select laminate-based FCIP) Low Moisture Absorption Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature) Fast, Efficient Flow Properties Self-filleting Capability Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.55 g/cc	ASTM D 792-00
Filler Content	54 %
Moisture Absorption at Equilibrium	1.14 %	24 hour boil; ASTM D5229/D 5229M-92 (1998) e1. D 570-98
Particle Size	<= 5.0 µm
Brookfield Viscosity	12000 cP	Brookfield #51 at 10 RPM; ASTM D2196-99
Storage Temperature	<= -40.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore D	>= 85	ASTM D 2240-03
Fracture Toughness	2.60 MPa-m½	ASTM D5045-99
Adhesive Bond Strength	5.00 MPa	Shear strength to polyimide passivated Die, 75 micron gap, at 200°C; DIN EN 60749-20
	81.0 MPa	Shear strength to polyimide passivated Die, 75 micron gap, at 25°C; DIN EN 60749-19

Electrical Properties	Original Value	Comments
Dielectric Constant	3.4 @Frequency 1000 - 100000 Hz
Dissipation Factor	0.0020 @Frequency 1000 Hz
	0.0030 @Frequency 10000 Hz
	0.0080 @Frequency 100000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	35.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	150 µm/m-°C @Temperature 20.0 °C	Alpha 2
Glass Transition Temp, Tg	117 °C	By DSC; ASTM D3418-99
Flash Point	>= 200 °C	ASTM D 93-02

Processing Properties	Original Value	Comments
Pot Life	720 min @Temperature 23.0 °C	Time to double viscosity; ISO 10364:1993
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Appearance	Black
Chemical Type	Aromatic Amine-Cured Epoxy
Extractable Ionic Content, Chloride (Cl)	<1 ppm
Extractable Ionic Content, Potassium (K)	<1 ppm
Extractable Ionic Content, Sodium (Na)	<1 ppm
Storage Modulus	6.2 GPa	ASTM D5023-01

**
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