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Ensinger PEI

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Henkel Loctite® ABLESTIK QMI534 Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: White paste

Product Benefits:

  • Hydrophobic
  • Stable at high temperatures
  • Void-free bondline
  • Excellent interfacial adhesion strength
Cure Heat cure

Application Semiconductor or NCA

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.25 g/cc
Moisture Absorption <= 0.350 %
@Temperature 85.0 °C
Cured, 168 hours @ 85% RH
Viscosity 9000 cPSpeed 5 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 300 MPaCured, DMA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cm
Dielectric Constant 2.7
@Frequency 1e+6 Hz
Cured
 
Thermal PropertiesOriginal ValueComments
CTE, linear 87.0 µm/m-°CCured, Below Tg
 171 µm/m-°CCured, Above Tg
Thermal Conductivity 0.400 W/m-KCured
Glass Transition Temp, Tg -35.0 °CCured
 
Processing PropertiesOriginal ValueComments
Cure Time >= 6.00 sec
@Temperature 240 °C
SkipCure
 15.0 min
@Temperature 150 °C
Conventional Oven
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
Extractable Ionic Content (ppm)<20Cured, Sodium (Na+)
 <20Cured, Potassium (K+)
 <20Cured, Chloride (Cl-)
 <20Cured, Fluoride (F-)
Shear Strength8 kg-fDie, 300 x 300 mm, 1 mm BLT, Si die on Ag-plated Cu LF
Thixotropic Index5Uncured, 0.5/5 rpm

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PLOCT5104 / 255315

Proto3000 – 3D Engineering Solutions

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