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Master Bond adhesives

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Asahi Kasei Leona™ 1500 Polyamide 66, High Molecular Weight
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66); Nylon 66, Unreinforced
Material Notes: Improved mechanical properties due to increased molecular weight.

Applications:Fasteners, sheets

Information provided by Asahi Kasei Corp.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.14 g/ccDry as Molded; ASTM D792
Moisture Absorption at Equilibrium 2.5 %
@Temperature 23.0 °C		50% RH
Linear Mold Shrinkage, Flow 0.013 - 0.020 cm/cmAsahi Kasei
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 55Conditioned at 50% RH; ASTM D785
 80Dry as Molded; ASTM D785
Hardness, Rockwell R 105Conditioned; ASTM D 785
 120Dry as Molded; ASTM D 785
Tensile Strength 57.0 MPaConditioned at 50% RH; ASTM D638
 79.0 MPaDry as Molded; ASTM D638
Elongation at Break 80 %Dry as Molded; ASTM D638
 270 %Conditioned at 50% RH; ASTM D638
Flexural Strength 54.0 MPaConditioned at 50% RH
 118 MPaDry as Molded
Flexural Modulus 1200 MPaConditioned at 50% RH; ASTM D790
 2800 MPaDry as Molded; ASTM D790
Izod Impact, Notched 49.0 J/mDry as Molded; ASTM D256
 176 J/mConditioned at 50% RH; ASTM D256
Taber Abrasion, mg/1000 Cycles 5.0Conditioned at 50% RH; ASTM D1044
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmASTM D257
Surface Resistance 1.00e+14 ohmDry as Molded; ASTM D257
Dielectric Strength 20.0 kV/mmDry as Molded; ASTM D149
 
Thermal PropertiesOriginal ValueComments
CTE, linear 80.0 µm/m-°CDry as Molded; ASTMD 696
Specific Heat Capacity 1.67 J/g-°CDry as Molded
Thermal Conductivity 0.200 W/m-KDry as Molded
Deflection Temperature at 0.46 MPa (66 psi) 230 °CDry as Molded; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 70.0 °CDry as Molded; ASTM D 648

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