| LORD CoolTherm™ MT-815 adhesive is a low modulus, silver-filled conductive adhesive which offers excellent electrical and thermal conductivity. CoolTherm MT-815 adhesive is designed for use in challenging thermal management applications, such as die attach for power semiconductor and LED packaging. CoolTherm MT-815 adhesive is low stress, making it suitable for use in large die applications. Features: exhibits low shrinkage and stress on components as it cures. provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold, Ni/Pd/Au lead frames and copper. provides high thermal conductivity for applications where superior heat dissipation is required. allows high-speed, accurate syringe dispensing of fine dots or lines; can be used with time/pressure, positive displacement or linear dispense heads. can be used on parts and devices that experience operating temperatures from -40°C to +125°C. All information provided by Lord. |
