Reltek BONDiT™ B-481 Adhesive, Sealant & Coating System

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Reltek BONDiT™ B-481 Adhesive, Sealant & Coating System
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	Key Properties: High strength and toughness with excellent thermal stability to 400°F. Outstanding chemical resistance. Excellent electrical, and mechanical properties. Ease of use. Applications: Encapsule sensitive instrumentation for chemical isolation, outstanding moisture resistance, ruggedness and flexibility. Suitable for clean room use and direct contact with semiconductors. Very easy to use and very clean two-part system. Superior for coating in marine applications and other harsh environments. Tough, high strength, chemically resistant non-blush clear coating with medium gloss finish. Bonds to most substrates. Can be applied to oily surfaces. Ambient 24 hour or accelerated thermal cure.
Key Words:	Epoxy Adhesive, Sealant
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Physical Properties	Original Value	Comments

Water Absorption	<= 1.0 %	24hrs boiling DI water
Viscosity	2500 cP

Mechanical Properties	Original Value	Comments
Tensile Strength at Break	4566 psi	3 hrs @ 200°F; 2:1 Volume Mix
Tensile Strength, Ultimate	4794 psi	Peak; 3 hrs @ 200°F; 2:1 Volume Mix
Tensile Strength, Yield	4794 psi	3 hrs @ 200°F; 2:1 Volume Mix
Elongation at Break	12.9 %	3 hrs @ 200°F; 2:1 Volume Mix
Elongation at Yield	9.6 %	3 hrs @ 200°F; 2:1 Volume Mix
Tangent Modulus	90425 psi	3 hrs @ 200°F; 2:1 Volume Mix

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	350 °F
Minimum Service Temperature, Air	-50.0 °F

Processing Properties	Original Value	Comments
Cure Time	360 min	Ambient Set
	1440 min	Ambient, 95% cure
	120 min @Temperature 65.6 °C	98% cure
Tack-Free Time	720 min	Ambient
Pot Life	40 min	Ambient

Descriptive Properties
Chemical & Moisture Resistance	3.5	0=Lowest, 4=Highest
Color	Clear with slight amber

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PAQREL04 / 24220

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