Celanese FORTRON 300 PPS, Unfilled

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Celanese FORTRON 300 PPS, Unfilled
Categories:	Polymer; Thermoplastic; Polyphenylene Sulfide (PPS)
Material Notes:	This grade designation represents a series of Fortron PPS grades used for extruding various shapes like Rod and Slab. These grades are the stiffest flowing unfilled products offered. For extrusion applications requiring a PPS grade with glass reinforce FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be =< - 30° C. The time between drying and processing should be as short as possible. For subsequent storage the material should be stored dry in the dryer until processed (<= 60 h). Information provided by Celanese Corporation.
Key Words:	Extrusion Grade
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Physical Properties	Original Value	Comments

Specific Gravity	1.40 g/cc	ASTM D792
Density	0.0505 lb/in³	ASTM D792
	1.316 g/cc	ISO 1183
Water Absorption	0.030 % @Temperature 22.8 °C	24hr immersion; ASTM D570
Linear Mold Shrinkage, Flow	0.010 in/in	ASTM D955
Linear Mold Shrinkage, Transverse	0.0080 in/in	ASTM D955

Mechanical Properties	Original Value	Comments
Hardness, Rockwell M	93	ASTM D785
Tensile Strength at Break	12500 psi @Temperature 22.8 °C	ASTM D638
Elongation at Break	3.0 % @Temperature 22.8 °C	ASTM D638
Tensile Modulus	2820 MPa	1mm/min; ISO 527-2/1A
Flexural Strength	21000 psi @Temperature 22.8 °C	ASTM D790
Flexural Modulus	2470 MPa	ISO 178
	600000 psi @Temperature 22.8 °C	ASTM D790
Izod Impact, Notched	0.500 ft-lb/in @Temperature 22.8 °C	ASTM D256
Izod Impact, Unnotched	6.00 ft-lb/in @Temperature 22.8 °C	ASTM D256
Izod Impact, Notched (ISO)	4.90 kJ/m²	ISO 180/1A
Izod Impact, Unnotched (ISO)	NB @Temperature 23.0 °C	ISO 180/1U
Charpy Impact Unnotched	89.1 kJ/m²	ISO 179/1eU
	226.1 kJ/m² @Temperature -30.0 °C	ISO 179/1eU
Charpy Impact, Notched	4.60 kJ/m²	ISO 179/1eA
	4.40 kJ/m² @Temperature -30.0 °C	ISO 179/1eA

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+9 ohm-cm	IEC 60093
	1.00e+16 ohm-cm	ASTM D257
Dielectric Constant	2.7 @Frequency 10000 Hz	IEC 60250
	2.8 @Frequency 1e+6 Hz	IEC 60250
	3.0 @Frequency 1000 Hz	ASTM D150
	3.0 @Frequency 1e+6 Hz	ASTM D150
Dielectric Strength	38.0 kV/mm	IEC 60243-1
Dissipation Factor	0.0010 @Frequency 1000 Hz	ASTM D150
	0.0010 @Frequency 1e+6 Hz	IEC 60250
	0.0020 @Frequency 1000 Hz	IEC 60250
	0.0090 @Frequency 1e+6 Hz	ASTM D150
Arc Resistance	124 sec	ASTM D495
Comparative Tracking Index	125 V	IEC 60112

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	53.0 µm/m-°C	ISO 11359-2
CTE, linear, Transverse to Flow	54.0 µm/m-°C	ISO 11359-2
Melting Point	280 °C	ISO 11357-1,-2,-3
Deflection Temperature at 0.46 MPa (66 psi)	392 °F	ASTM D648
Deflection Temperature at 1.8 MPa (264 psi)	83.0 °C	ISO 75-1, -2
	221 °F	ASTM D648
Deflection Temperature at 8.0 MPa	73.0 °C	ISO 75-1, -2
Glass Transition Temp, Tg	90.0 °C	ISO 11357-1,-2,-3

Processing Properties	Original Value	Comments
Processing Temperature	20.0 - 30.0 °C	hopper
Melt Temperature	321 °C	ISO 294
Mold Temperature	135 °C	ISO 294
Injection Velocity	275 mm/sec	ISO 294
Drying Temperature	110 - 120 °C
Dry Time	3 - 4 hour
Moisture Content	0.020 %	Necessary low maximum
Injection Pressure	83.0 MPa	ISO 294

Descriptive Properties
Injection molding	No

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