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Chemically Resistant adhesives

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Master Bond EP36AO One Part, Thermally Conductive, Heat Resistant Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced; Epoxy, High Temperature; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Available in 30 gram performs
  • High temperature resistant
  • Thermally conductive
  • Flexibilized and toughened
  • Unlimited working life at room temperature
  • Electrically insulative
Product Description: Master Bond EP36AO is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring thermal conductivity, electrical insulation and high temperature resistance. It differs greatly from other heat resistant epoxies as it has far more toughness and flexibility at elevated temperatures. Its forgiving nature at high temperatures imparts vastly superior thermal and mechanical shock resistance as well as superb thermal cycling ability when compared to more standard high temperature resistant epoxies. EP36AO bonds well to a variety of substrates including metals, composites, glass and many plastics. It has good chemical resistance to water, fuels and oils. This one component system is primarily used for potting but can also be used for bonding and sealing. The service temperature range is -100°F to +500°F. As mentioned above, EP36AO retains toughness and heat resistance up to 500°F without losing its critical properties. The hardness remains consistent (20-30 Shore D) above its Tg, and it is still able to withstand rigorous thermal cycling. EP36AO is ideal for potting and encapsulation applications where thermal conductivity, electrical isolation and the ability to withstand severe thermal cycling over a wide temperature range are needed. While EP36AO is an unconventional epoxy, it is conveniently available in 30 gram preforms as well as pints and quarts. This system is formulated at elevated temperatures and poured into cans or 30 gram cookie molds and solidifies. Since it is a solid; it must be heated in a forced air or convection oven at 170-180°F to transform it to a liquid. As a liquid, it is easy to apply as an encapsulant or an adhesive. To complete the cure, the temperature should be 350°F for 2-3 hours. EP36AO will retain its liquidity as long as the temperature does not exceed 180°F. Liquefied but uncured material can be reused by allowing EP36AO to resolidify at room temperature. Cured material cannot reliquefy; resolidified epoxy can become liquid again. This epoxy is off-white in color. A more detailed description of curing the 30 gram cookie appears in the cure section below EP36AO is truly a specialty type system that is primarily used in electronic and aerospace applications.

Product Advantages:

  • One component system
  • Superb thermal conductivity and electrical insulation properties
  • Combines flexibility and toughness with high temperature resistance
  • Ideal for potting and encapsulation
  • Unused material is easy to reprocess
  • Available in conveniently prepared 30 gram performs
  • Capable of withstanding rigorous thermal cycling and thermal shocks

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 80000 - 120000 cP
@Temperature 82.2 - 93.3 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 24
@Temperature 149 °C
 28
@Temperature 100 °C
 80
@Temperature 23.9 °C
Tensile Strength >= 2000 psi
Elongation at Break >= 50 %
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.1
Dielectric Strength 440 V/mil
 
Thermal PropertiesOriginal ValueComments
CTE, linear 75.0 - 85.0 µm/m-°C
Thermal Conductivity 1.2981 - 1.4423 W/m-K
Maximum Service Temperature, Air 500 °F
Minimum Service Temperature, Air -100 °F
Glass Transition Temp, Tg 95.0 - 100 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 177 °C
liquefy at minimum 170-180°F then
Shelf Life 6.00 Month
@Temperature 4.44 - 10.0 °C
in original, unopened containers

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PMASTM872 / 185465

Chemically Resistant adhesives

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