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Celanese Hostaform® C 9021 10/9005 POM, Unfilled
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM)

Material Notes: Hostaform« C 9021 10/9005 is a nominal 9 melt flow rate acetal copolymer which is capable of being permanently marked by a laser. Parts molded from Hostaform« C 9021 10/9005 can be laser marked with barcodes, identification numbers, designs, 2-D symbology, etc.

Information provided by Celanese

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Physical PropertiesOriginal ValueComments
Density 1.41 g/ccISO 1183
Density of Compound 1.20 g/cc
Water Absorption at Saturation 0.65 %ISO 62
Linear Mold Shrinkage, Flow 0.020 cm/cmISO 294-4
Linear Mold Shrinkage, Transverse 0.018 cm/cmISO 294-4
Melt Flow 8.0 g/10 min
@Load 2.16 kg,
Temperature 190 °C
[cm3/10min]; ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 64.0 MPa50mm/min; ISO 527-2/1A
Elongation at Break 25 %
Elongation at Yield 9.0 %50mm/min; ISO 527-2/1A
Tensile Modulus 2850 MPa50mm/min; ISO 527-2/1A
Flexural Modulus 2700 MPaISO 178
Charpy Impact Unnotched 180 kJ/m²partial break; ISO 179/1eU
 160 kJ/m²
@Temperature -30.0 °C
ISO 179/1eU
Charpy Impact, Notched 5.50 kJ/m²ISO 179/1eA
 5.00 kJ/m²
@Temperature -30.0 °C
ISO 179/1eA
Tensile Creep Modulus, 1 hour 2500 MPaISO 899-1
Tensile Creep Modulus, 1000 hours 1300 MPaISO 899-1
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 ohm-cmIEC 60093
Surface Resistance 1.00e+14 ohmIEC 60093
Dielectric Constant 4.0
@Frequency 1e+6 Hz
IEC 60250
 4.0
@Frequency 100 Hz
IEC 60250
Dielectric Strength 35.0 kV/mmIEC 60243-1
Dissipation Factor 0.0020
@Frequency 100 Hz
IEC 60250
 0.0050
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 600 VIEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 110 µm/m-°CISO 11359-2
CTE, linear, Transverse to Flow 110 µm/m-°CISO 11359-2
Specific Heat Capacity 2.21 J/g-°C
Thermal Conductivity 0.155 W/m-K
Melting Point 166 °C10°C/min; ISO 11357-1,-2,-3
Deflection Temperature at 1.8 MPa (264 psi) 104 °CISO 75-1, -2
Flammability, UL94 HB
@Thickness 1.50 mm
 HB
@Thickness 3.00 mm
 
Processing PropertiesOriginal ValueComments
Processing Temperature 80.0 - 120 °Ccavity
 190 - 210 °Chot runner
Feed Temperature 60.0 - 80.0 °C
Zone 1 170 - 180 °C
Zone 2 180 - 190 °C
Zone 3 190 - 200 °C
Zone 4 190 - 210 °C
Die Temperature 190 - 210 °C
Melt Temperature 190 - 210 °C
Ejection Temperature 140 °C
Drying Temperature 120 - 140 °C
Dry Time 3.00 - 4.00 hour
Moisture Content <= 0.15 %
Injection Pressure 60.0 - 120 MPa
Hold Pressure 60.0 - 120 MPa
Back Pressure <= 4.00 MPa
Screw Speed 70 rpm
@Diameter 55.0 mm
 100 rpm
@Diameter 40.0 mm
 150 rpm
@Diameter 25.0 mm
 
Descriptive Properties
Eff. thermal diffusivity4.85E-08[m^2/s]
Injection moldingYes
Injection speedslow-medium
Processing conditions acc. ISO9988
pvT (Generic Grade reference)POM K, M-RN

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