Bakelite® PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength

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Bakelite® PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Categories:	Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic
Material Notes:	Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed molding compound 0.75 mm / V-0 (BK). Applications: Solenoid switch caps, insulating flanges, automotive engine parts, steering housings, electric motor parts, carbon brush holders, medium strength and heat resistant cookware fittings.
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Physical Properties	Original Value	Comments

Density	1.57 g/cc	ISO 1183
Apparent Bulk Density	0.700 g/cc	ISO 60
Linear Mold Shrinkage	0.0025 cm/cm	Compression Molding. Post Shrinkage = 0.2%.; ISO 2577
	0.0050 cm/cm	Injection Molding. Post Shrinkage = 0.25%.; ISO 2577

Mechanical Properties	Original Value	Comments
Ball Indentation Hardness	350 MPa	H961/30; ISO 2039/P1
Tensile Strength	65.0 MPa	ISO 527 - 1/2
Tensile Modulus	10500 MPa	ISO 527 - 1/2
Flexural Strength	125 MPa	ISO 178
Flexural Modulus	11000 MPa	ISO 178
Compressive Strength	220 MPa	ISO 604
Charpy Impact Unnotched	9.50 kJ/m²	ISO 179-1 eU
Charpy Impact, Notched	2.20 kJ/m²	ISO 179-1eA

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+12 ohm-cm
Surface Resistance	1.00e+11 ohm
Dielectric Constant	9.0 @Frequency 100 Hz
Dielectric Strength	25.0 kV/mm @Thickness 1.00 mm	IEC 60243-P1
Dissipation Factor	0.25 @Frequency 100 Hz
Arc Resistance	130 - 135 sec	ASTM D495
Comparative Tracking Index	175 V
Hot Wire Ignition, HWI	>= 120 sec @Thickness 0.750 mm	BK
High Amp Arc Ignition, HAI	>= 120 arcs @Thickness 0.750 mm	BK
High Voltage Arc-Tracking Rate, HVTR	0.000 - 10.0 mm/min @Thickness 3.00 mm	BK

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	170 °C	<20000 hours; IEC 60216-P1
	230 °C	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	155 °C	ISO 75-2
UL RTI, Electrical	150 °C @Thickness 0.750 mm	BK
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	BK
UL RTI, Mechanical without Impact	150 °C @Thickness 0.750 mm	BK
Flammability, UL94	V-0 @Thickness 0.750 mm	BK

Processing Properties	Original Value	Comments
Feed Temperature	60.0 - 75.0 °C	Injection molding
Nozzle Temperature	80.0 - 100 °C	Injection molding
Melt Temperature	80.0 - 100 °C	Injection molding
Mold Temperature	160 - 190 °C	Injection molding
	160 - 190 °C	Compression molding
Injection Pressure	>= 15.0 MPa	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	Injection molding
Cure Time	10.0 - 20.0 sec	Per 1 mm of wall thickness, injection molding
	20.0 - 40.0 sec	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Chromatic Spectrum	All Colors
Creep Rupture Strength	Very Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Very Good
Thermal Expansion	Very Slight
Water absorption (mg)	30	24h / 23°C

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