Henkel Loctite® ABLESTIK NCF 218 Film

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Henkel Loctite® ABLESTIK NCF 218 Film
Categories:	Polymer
Material Notes:	Appearance: Transparent yellow film Product Benefits: Enable fine pitch, narrow gap Cu Pillar Cure: Heat cure Application: Semiconductor, Films Typical Applications: Thermal Compression Bonding LOCTITE ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low ?, thin gap, large and thin die used in advance flip chip applications. This material is suitable for die to die, die to wafer (TSV) or die to substrate applications. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	1.20 % @Temperature 85.0 °C	Saturation, after 85% RH exposure

Mechanical Properties	Original Value	Comments
Tensile Modulus	110 MPa @Temperature 250 °C	Cured, Storage
	6400 MPa @Temperature 25.0 °C	Cured, Storage
Shear Strength	5.40 MPa @Temperature 260 °C	Hot Die, 3 x 3 mm SiN die on BT substrate

Thermal Properties	Original Value	Comments
CTE, linear	24.0 µm/m-°C	Cured, Below Tg
	190 µm/m-°C	Cured, Above Tg
Maximum Service Temperature, Air	162 °C	Differential Scanning Calorimetry, On-set temperature
	168 °C	Differential Scanning Calorimetry, Peak temperature
Glass Transition Temp, Tg	119 °C	post cure TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175ºC, hold 2 hours @ 175°C
Shelf Life	6.00 Month @Temperature 5.00 °C	Uncured

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<10	Cured, Chloride (Cl-)
Weight Loss (%)	1.2	TGA @ 250 °C

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PLOCT5058 / 255269

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