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Ensinger PEI

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Parker Chomerics CHO-BOND® 2165 Polyurethane Sealant
Categories: Polymer; Thermoset; Polyurethane, TS

Material Notes: Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is highly resistant to aircraft fluids and to corrosion.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.85 g/ccASTM 0792
Solids Content >= 95 %ASTM D1259
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 73ASTM D2240
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0070 ohm-cm95-40-5555
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 85.0 °C
Minimum Service Temperature, Air -40.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 0.500 hour
@Temperature 125 °C
after 4 hrs at RT
 2.00 hour
@Temperature 93.0 °C
after 4 hrs at RT
 168 hour
@Temperature 24.0 °C
Tack-Free Time 240 minat RT, 50% RH
Shelf Life 9.00 Monthunopened
 
Descriptive Properties
Mix Ratio100 to 7.021A:B
Working Life1 hr

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