Cookson Group POLYSOLDER® LTD One Part Electrically Conductive Adhesive Paste

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Cookson Group POLYSOLDER® LTD One Part Electrically Conductive Adhesive Paste (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	This material is a lead-free, no clean, environmentally acceptable solder substitute specifically designed for electronic component assembly, especially surface mount. This product is specially designed for pneumatic dispensing. The material is hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This patented product is a unique electronics polymer material that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging. Features: Pb-Free Intrinsically Clean Fine Pitch Low Stress Stable Junctions Removable Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Filler Content	76 - 80 %
Viscosity	150000 - 200000 cP @Temperature 25.0 °C	HBT 5x cp-51 spindle, 1 rpm

Mechanical Properties	Original Value	Comments
Adhesive Bond Strength	>= 2200 psi	Die shear

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.00050 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	54.0 µm/m-°C	Below Tg
Thermal Conductivity	3.50 W/m-K
Glass Transition Temp, Tg	90.0 °C

Processing Properties	Original Value	Comments
Pot Life	480 - 720 min	On screen
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Assembly Temperature	130-170°C
Junction Resistivity	<25 mohm	Typical, tin-lead coated components
Push Off Strength	13-15 lbs	1206 chip resistor
	35-40 lbs	68PLCC quad pack, 50 mil pitch

**
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PPLASK087 / 56377

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