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Master Bond adhesives

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Inktec Silver Conductive inks
Categories: Other Engineering Material; Ceramic/Metallic Coating

Material Notes: InkTec Electronic Ink is applicable to various industries such as RFID in distribution industry, smart label, PCB/FPCB, displays(OLED, LCD), EMI shielding Solar cell and TSP etc.. And the ink is expected to be the core material of mass printing process which is a new paradigm in IT & electric industry and to reduce processes and cost in RFID component market.. Especially, InkTec recently shows great achievement in TSP & thin film solar cell market.

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Physical PropertiesOriginal ValueComments
Filler Content 5.0 - 73 %Silver (Ag)
Particle Size 1.6 µm
Viscosity 3.0 - 160000 cP
Thickness 0.200 - 7.00 microns
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0000042 - 0.000080 ohm-cm
 
Processing PropertiesOriginal ValueComments
Cure Time 300 - 1200 sec
 
Descriptive Properties
Adhesion5B
Binder SystemVarious
Conductive Filler TypeSilver (Ag)
Material TypeOther
Solvent SystemVarious

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PFLEXCM32 / 179434

Rulon Bearings

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