Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy

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Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, High Temperature
Material Notes:	Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This product is a color-coded, black and opaque version of the industry standard EPO-TEK® 353ND-T epoxy adhesive. Suggested applications: Semiconductor, glob top DAM around IC’s, using COB or DCA packaging formats Electronics Assembly Insulating adhesive for bonding stainless steel metals, ceramics and carbon composites used in ink-jetting heads Insulating and plugging wires and feed-through cables of automotive circuits Hard Disk Drive – thixotropic staking and termination of Al and Cu coils Adhesive for brushless motors and Cu coil windings Medical Light blocking in endoscopes, camera optics and IR sensor devices Optical Fiber optic component packaging: bonding fibers, active optics, metals, ceramics and plastic Available in alternative viscosities and color Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.02 g/cc	Part B
	1.12 g/cc	Part A
Particle Size	<= 20 µm
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	20 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Tensile Modulus	559120 psi	Storage
Shear Strength	>= 2000 psi	Lap
	>= 5100 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 4.00e+12 ohm-cm
Dielectric Constant	3.21 @Frequency 1000 Hz
Dissipation Factor	0.0030 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	43.0 µm/m-°C	Below Tg
	231 µm/m-°C	Above Tg
Maximum Service Temperature, Air	225 °C	Continuous
	325 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	409 °C	Degradation Temperature

Optical Properties	Original Value	Comments
Transmission, Visible	<= 5.0 % @Wavelength 300 - 1460 nm	Spectral
	<= 7.0 % @Wavelength 1550 nm	Spectral

Processing Properties	Original Value	Comments
Cure Time	1.00 min @Temperature 150 °C	Minimum Bond Line
	5.00 min @Temperature 120 °C	Minimum Bond Line
	10.0 min @Temperature 100 °C	Minimum Bond Line
	30.0 min @Temperature 80.0 °C	Minimum Bond Line
Pot Life	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Amber	Part B
	Black	Part A
Consistency	Smooth, thixotropic paste
Mix Ratio by Weight	10:1
Number of Components	Two
Thixotropic Index	3.8
Weight Loss	0.53%	200°C
	1.22%	250°C
	2.37%	300°C

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