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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® T6065 Thermally Conductive Semiconductor Die-Attach Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes:

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.68 g/cc
Particle Size <= 20 µm
Viscosity 80000 - 120000 cP
@Temperature 23.0 °C
2.5 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 48 ppm
Ionic Impurities - K (Potassium) 6.0 ppm
Ionic Impurities - Cl (Chloride) 135 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 92
Tensile Modulus 816000 psiStorage
Shear Strength >= 2000 psiLap
 >= 6800 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.20e+14 ohm-cm
Dielectric Constant 5.3
@Frequency 1000 Hz
Dissipation Factor 0.011
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 38.0 µm/m-°CBelow Tg
 136 µm/m-°CAbove Tg
Thermal Conductivity 0.794 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 397 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 180 °C
Minimum
Pot Life 40320 min
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
ColorWhite
ConsistencySmooth paste
Ionic Impurities NH4105 ppm
Number of ComponentsSingle
Thixotropic Index1.88
Weight Loss0.1%200°C
 0.16%250°C
 0.3%300°C

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PPOXYT088 / 141127

Chemically Resistant adhesives

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