Henkel Loctite® ECCOBOND FP 5201 BMI/Acrylate

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Henkel Loctite® ECCOBOND FP 5201 BMI/Acrylate
Categories:	Polymer
Material Notes:	Components: One-component Cure: Heat cure Product Benefits: High purity Non-conductive Excellent protection of electrical joints Compatible with small assembly gap and tight pitches Application: Underfill Metal Interconnect Gold, Solder and Cu pillar Substrates: Solder, Gold and Cu pads on fine pitch laminate Typical Application: Flex applications LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.60 g/cc
Brookfield Viscosity	21000 cP	Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	5800 MPa	DMA, Cured

Thermal Properties	Original Value	Comments
CTE, linear	31.0 µm/m-°C	Cured, Below Tg
	65.0 µm/m-°C	Cured, Above Tg
Maximum Service Temperature, Air	125 °C	DSC, Exotherm onset
	134 °C	DSC, Peak Temperature
Glass Transition Temp, Tg	171 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	2.00 sec @Temperature 240 - 280 °C	Thermal Compression Bonder (
	3.00 sec @Temperature 240 - 280 °C	Thermal Compression Bonder (
	4.00 sec @Temperature 240 - 280 °C	Thermal Compression Bonder (
	30.0 min @Temperature 165 °C	Oven Cure
Shelf Life	12.0 Month @Temperature -20.0 °C

Descriptive Properties
Extractable Ionic Content (ppm)	<5	Cured, Sodium (Na+)
	<5	Cured, Potassium (K+)
	<5	Cured, Chloride (Cl-)
	<5	Cured, Fluoride (F-)
Pot Life	2 days
Thixotropic Index	3.5	Uncured

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PLOCT5093 / 255304

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