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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

Advantages & Application Notes:

  • Low viscosity, clear and colorless epoxy is well suited for potting applications, and for transmitting VIS or NIR light in opto-circuits.
  • Excellent water, chemical, and solvent resistant properties including 10% nitric acid, acetone, hexane, and dichlorormethane.
  • Suggested Applications:
    • Fiber Optic/Optical:
      • Potting and encapsulation; lens and prism bonding for Scientific / OEM instruments; LED encapsulant.
      • Transmission in the VIS/NIR range from 350 – 1550 nm. Can be used in the optical pathway.
      • Potting or sealing the fiber into the snout of the opto-package.
      • Adhesive for V-groove, fiber arrays or lens arrays.
      • Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic.
    • Semiconductor:
      • Recommended for underfilling of flip chips or SMDs on PCB; can also be used for COB glob top process using a DAM/FILL method; can resist 85/85 moisture soaks, as well as Tcycles and Tshocks.
    • Medical:
      • Wicking into fiber optic bundles for endoscopes or light guides; very good autoclave resistance.
      • Adhesion to stainless steel metal, ceramic, titanium and most plastics.
      • USP Class VI bio-compatible.
    • Passes NASA low outgassing standard ASTM E595 with proper cure
    • This product has been tested and satisfies low halogen requirements.

    Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 0.960 g/ccPart B
 1.20 g/ccPart A
Viscosity 800 - 1600 cP
@Temperature 23.0 °C
100 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 10 ppm
Ionic Impurities - K (Potassium) 4.0 ppm
Ionic Impurities - Cl (Chloride) 42 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80
Tensile Modulus 252000 psiStorage
Shear Strength >= 2000 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cm
Dielectric Constant 3.39
@Frequency 1000 Hz
Dissipation Factor 0.0061
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 56.0 µm/m-°CBelow Tg
 193 µm/m-°CAbove Tg
Maximum Service Temperature, Air 175 °CContinuous
 250 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 55.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 351 °CDegradation Temperature
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.5446
@Wavelength 589 nm
uncured
Transmission, Visible >= 95 %
@Wavelength 460 - 1620 nm
Spectral
 
Processing PropertiesOriginal ValueComments
Cure Time 3.00 hour
@Temperature 65.0 °C
 24.0 hour
@Temperature 23.0 °C
Pot Life 60 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes
 
Descriptive Properties
ColorClear/ColorlessPart A
 Clear/ColorlessPart B
ConsistencyPourable liquid
Ionic Impurities NH41 ppm
Mix Ratio by Weight100:45
Number of ComponentsTwo
Weight Loss0.77%250°C
 1.22%300°C

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PPOXYT110 / 141149

USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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