Surface Mount Adhesives Loctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly: - High Speed Dispense
- Low Temperature Cure
- Products for difficult-to-bond substrates
Loctite® 3609 CHIPBONDER® Syringe Dispense For high speed dot placement. Good green strength. A choice of colors for best vision pickup on light or dark surfaces.Peaked dot profile. Process Method: - Medium speed
- Syringe dispensing
- 18,000 DPH capable
Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)
|