| As a sacrificial heat source in soldering and brazing applications, NanoFoil® is ideal for high-temperature applications. NanoFoil becomes a non-functional part of the solder or braze joint, eliminating the need for an oven or furnace and allowing for the use of higher temperature solders. Features: - Rapid, controlled, locally applied heat source
- Instantaneous, flux-free soldering and brazing at room temperature
- Suitable for use with high-temperature solders or brazes
- Enables high-strength bonds between most combinations of materials
- Pb-free
- Composition before Reaction - Alternating layers of Ni and Al
- Composition after Reaction - Ni50Al50
Applications: - Reaction initiation
- Reaction delay
- Fuses
- Joining of dissimilar materials in large area formats, such as sputtering targets, armor, and other rigid assemblies
- Soldering or brazing of temperature-sensitive electronics components or assemblies.
Information provided by the manufacturer, Indium Corporation of America. Information Provided by Indium Corporation |
