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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes: Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.

Advantages & Application Notes:

  • Low density silver-filled epoxy is ideal for ultrasound and acoustical applications of electronics.
  • Extended pot-life allows for mass production and low waste.
  • Suggested Applications:
    • Hybrid Micro-electronics: SMD and die attach on Au pads and ceramic substrates. Single step curing method of die and SMDs.
    • Electronics: compatible with piezo technologies for ultrasound circuits found in medical, industrial, and petrochemical industries.
    • Scientific / Life Sciences: geo-thermal, geo-seismic, infra-sound, as well as acoustical-optical circuits for interferometers and lasers.
    • Optical: bright and shiny silver flake is advantageous for LED die-attach.
  • A smooth and creamy paste allows for automated or hand dispensing, pin transfer, or screen printing application methods of manufacture.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.05 g/ccPart B
 2.10 g/ccPart A
Particle Size <= 45 µm
Viscosity 15000 - 23000 cP
@Temperature 23.0 °C		10 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 88 ppm
Ionic Impurities - K (Potassium) 8.0 ppm
Ionic Impurities - Cl (Chloride) 60 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 76
Tensile Modulus 485000 psiStorage
Shear Strength >= 1700 psiDie
 >= 2000 psiLap
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.020 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 28.0 µm/m-°CBelow Tg
 104 µm/m-°CAbove Tg
Thermal Conductivity 0.670 W/m-K
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 470 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 150 °C		Minimum Bond Line
 10.0 min
@Temperature 120 °C		Minimum Bond Line
 20.0 min
@Temperature 100 °C		Minimum Bond Line
 45.0 min
@Temperature 80.0 °C		Minimum Bond Line
Pot Life 1080 min
Shelf Life 6.00 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth paste
Ionic Impurities NH421 ppm
Mix Ratio by Weight100:5
Number of ComponentsTwo
Thixotropic Index1.86
Weight Loss0.04%200°C
 0.04%250°C
 0.1%300°C

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PPOXYT039 / 141078

Chemically Resistant adhesives




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