Henkel Loctite® ABLESTIK QMI519 Adhesive

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Henkel Loctite® ABLESTIK QMI519 Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: Electrically conductive Thermally conductive One component Ease of use Void-free bondline Hydrophobic Stable at high temperatures High resistance to delamination Good resistance to "popcorning" after exposure to reflow temperatures Cure: Heat cure Application: Die attach Key Substrates: Wide variety of metals and ceramic surfaces, Copper, Silver, Palladium and Alloy 42 Typical Package Application: SOIC, SOP, QFP and QFN type packages LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	3.80 g/cc
Moisture Absorption	<= 0.200 % @Temperature 85.0 °C	168 hrs, 85% RH exposure
Viscosity	9000 cP	Uncured, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	5300 MPa	Cured, Young's
Shear Strength	10.0 MPa	Die, 300 X 300 mil, 1 mil bondline thickness Ag plated Cu

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00010 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C	Cured, alpha1
	140 µm/m-°C	Cured, alpha2
Thermal Conductivity	3.80 W/m-K
Glass Transition Temp, Tg	75.0 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	>= 0.167 min @Temperature 200 °C	Skip Cure Process
	15.0 min @Temperature 185 °C	Alternative Cure Schedule 1
	15.0 min @Temperature 200 - 220 °C	Alternative Cure Schedule 2
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Chloride (Cl-)
	<20	Cured, Potassium (K+)
	<20	Cured, Sodium (Na+)
	<20	Cured, Fluoride (F-)
Pot Life	48 hrs
Thixotropic Index	4.2	Speed 0.5/speed 5

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PLOCT5060 / 255271

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