Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher glass transition temperature Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC level 3 Applications: Plaskon? MUF-2A LAR Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential. Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.89 g/cc
Viscosity	4000 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage	0.00050 cm/cm
Spiral Flow	150 cm	at 175°C and 1000 psi
Ash	80 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	Cull hot
Flexural Strength	12090 psi
	4978.2 psi @Temperature 215 °C
Flexural Modulus	2.560e+6 psi
	853400 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	4.50e+15 ohm-cm
Dielectric Constant	3.13 @Frequency 1000 Hz
Dielectric Strength	>= 800 V/mil
Dissipation Factor	0.0017 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	55.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.750 W/m-K
Glass Transition Temp, Tg	195 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	165 - 170 °C
Back Pressure	500 - 900 psi
Cure Time	100 - 200 sec	In mold
Gel Time	0.267 min	Ram follower, at 175°C/1000psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Alpha Particle Count	<0.0015 counts/cm2/hr
Hydrolyzable Halides	<1 ppm
Preform Temperature	80-85°C
Transfer Time	6-15 seconds

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound
G-10 Fiberglass Epoxy Laminate Sheet
Overview of materials for Epoxy Molding Compound
Cookson Group Plaskon® AMC-2RA Low Stress Epoxy Molding Compound
Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant

PPLASK009 / 56299

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message