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Chemically Resistant adhesives

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Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes: Superior thermal performance while maintaining low modulus and flows into complex geometries to maintain intimate contact with component

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.08 g/ccASTM D792
Viscosity >= 5.0 cPASTM D2196
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 25ASTM D2240
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 ohm-cmASTM D257
Dielectric Constant 8.0
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 10.0 kV/mmASTM D149
Dissipation Factor 0.010
@Frequency 1e+6 Hz
Chomerics
 
Thermal PropertiesOriginal ValueComments
CTE, linear 150 µm/m-°CASTM E831
Specific Heat Capacity 0.900 J/g-°CASTM E1269
Thermal Conductivity 3.00 W/m-KASTM D5470
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -50.0 °C
Brittleness Temperature -55.0 °CASTM D2137
 
Processing PropertiesOriginal ValueComments
Cure Time 0.0500 hour
@Temperature 150 °C
 1.00 hour
@Temperature 60.0 °C
 48.0 hour
@Temperature 23.0 °C
Pot Life 300 min
@Temperature 23.0 °C
2X Starting Viscosity
Shelf Life 3.00 MonthFrom date of Manufacture
 
Descriptive Properties
BinderSilicone
ColorGray
Extractable Silicone0.085
FillerAluminum Oxide
Mix Ratio1:1
Number of Components2-part

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PCHOME423 / 131133

Chemically Resistant adhesives

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