Momentive Performance Materials TSE3261-G Heat Resistant Silicone Adhesive

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Momentive Performance Materials TSE3261-G Heat Resistant Silicone Adhesive (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade
Material Notes:	TSE3261-G is a one-component heat curable silicone adhesive designed for high temperature applications. TSE3261-G adheres well to a variety of substrates such as metals, plastics, ceramics and glass without the use of a primer. Cured properties for specimen cured 1 hour at 150°C. Key Performance Properties: Ready to use - one component Excellent high temperature resistance Heat accelerated cure Excellent adhesive properties; primerless adhesion to many types of substrates Gray color Non corrosive to metals Applications: Sealing and bonding for high temperature applications Heaters Steam Irons Microwave Ovens Sealing, bonding and potting for electrical appliances and electronic parts. GE Silicones became a part of Momentive Performance Materials in 2006.
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Physical Properties	Original Value	Comments

Specific Gravity	1.48 g/cc @Temperature 23.0 °C
Viscosity	80000 cP

Mechanical Properties	Original Value	Comments
Hardness, Shore A	54
Tensile Strength at Break	4.90 MPa
Elongation at Break	160 %
Adhesive Bond Strength	257 psi	Aluminum lap shear

Electrical Properties	Original Value	Comments
Volume Resistivity	2.00e+15 ohm-cm
Dielectric Constant	3.3
Dielectric Strength	22.0 kV/mm
Dissipation Factor	0.020

Thermal Properties	Original Value	Comments
Thermal Conductivity	0.410 W/m-K

Descriptive Properties
Color	Gray
Consistency	Flowable

**
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