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Master Bond adhesives

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CeramTec Alunit® Aluminum Nitride
Categories: Ceramic; Nitride

Material Notes: Alunit® offers an extremely high thermal conductivity of 180 W/mK and outstanding electrical insulation properties. The thermal expansion coefficient of this material is comparable to silicon. Its electrical and mechanical characteristics are similar to aluminum oxide. Alunit® is non-toxic and environmentally compatible, presenting no disposal problems. Alunit® substrates come in a variety of surface finishes: as fired, as fired superior, ground, or polished. They can be manufactured by using tape casting, dry pressing, lasering, or metallizing. Typical applications include: power electronics, IGBT modules, telecommunications, cooling devices, DCB (Direct Copper Bonding), and LEDs.

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Physical PropertiesOriginal ValueComments
Density 3.33 g/ccDIN EN 623-2 / ASTM-C373 / ASTM-C20
Water Absorption 0.00 %DIN EN 623-2 / ASTM-C373
Particle Size 4.0 - 5.0 µmMedian Grain (d50)
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 320 GPaASTM-F417
Flexural Strength 360 MPaBending Strength; 4-Point Method (40x4x3 mm³); ASTM-F417
Poissons Ratio 0.32ASTM C-1259-94
Shear Modulus 121 GPaCalculated
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmASTM-D257
Dielectric Constant 9.0
@Frequency 1e+6 Hz
IEC 672-1 / ASTM-C150
Dielectric Breakdown 16000 V
@Thickness 1.00 mm
Dielectric Loss Index 0.00010
@Frequency 1e+6 Hz
IEC 672-1 / ASTM-D149,150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 4.70 µm/m-°C
@Temperature 20.0 - 200 °C
 5.20 µm/m-°C
@Temperature 20.0 - 600 °C
ASTM-C373
 5.60 µm/m-°C
@Temperature 20.0 - 1000 °C
Specific Heat Capacity 0.740 J/g-°C
@Temperature 100 - 200 °C
DINV ENV 821-3
Thermal Conductivity 180 W/m-KDIN EN 821-2 / ASTM-C408
 
Descriptive Properties
ColorTranslucent Medium Gray
Ra = Arithmetic Mean Roughness Value (µm)Profilometer (0.8 mm Cutoff)

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