Cookson Group Plaskon® SMT-B-1RC Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1RC Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for PBGA applications. It is a fast cure molding compound for automold applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications. Features: Faster cure speed Improved wire sweep performance Improved warp performance High productivity Lower viscosity Reduced cure time Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.88 g/cc
Viscosity	5500 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage	0.00050 cm/cm
Spiral Flow	105 cm	at 175°C and 1000 psi
Ash	78 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	86	Cull hot
Flexural Strength	14080 psi
	5831.6 psi @Temperature 215 °C
Flexural Modulus	1.863e+6 psi
	853400 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	2.00e+16 ohm-cm @Temperature 22.0 °C
Dielectric Constant	3.9 @Frequency 1000 Hz
Dielectric Strength	700 V/mil
Dissipation Factor	0.0040 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	15.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	55.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.800 W/m-K
Glass Transition Temp, Tg	226 °C
Flammability, UL94	V-0 @Thickness 3.17 mm
Oxygen Index	32 %

Processing Properties	Original Value	Comments
Mold Temperature	175 °C
Back Pressure	800 - 1200 psi
Cycle Time - Injection	60 - 150 sec
Cure Time	0.000 - 4.00 hour @Temperature 175 °C	Post mold
Gel Time	0.200 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm
Preheat Temperature	85-98°C

**
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