ASI® MP 54270 Epoxy Adhesive

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ASI® MP 54270 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP54270 is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures quickly at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release. It has very good resistance to water, acids and bases and most organic solvents. It was formulated to a 1A:1B volume mix ratio for use in side-by-side cartridges and meter/mix dispensing equipment. MP54270 will reach full cure at room temperature within 24 hours. Information provided by Adhesive Systems, Inc.
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Physical Properties	Metric	English	Comments

Specific Gravity	0.970 g/cc @Temperature 25.0 °C	0.970 g/cc @Temperature 77.0 °F	part B
	1.10 g/cc @Temperature 25.0 °C	1.10 g/cc @Temperature 77.0 °F	mixed
	1.16 g/cc @Temperature 25.0 °C	1.16 g/cc @Temperature 77.0 °F	part A
Viscosity	8000 cP	8000 cP	part B
	10000 cP	10000 cP	mixed
	12000 cP	12000 cP	part A

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Strength	51.7 MPa	7500 psi
Elongation at Break	>= 4.0 %	>= 4.0 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 8.30e+14 ohm-cm	>= 8.30e+14 ohm-cm
Dielectric Constant	3.5 @Frequency 100 Hz, Temperature 25.0 °C	3.5 @Frequency 100 Hz, Temperature 77.0 °F
Dielectric Strength	16.1 kV/mm	410 kV/in

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 65.0 °C	1.00 hour @Temperature 149 °F
	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Pot Life	20.0 - 30.0 min	20.0 - 30.0 min	50 grams
Shelf Life	12.0 Month	12.0 Month	In unopened container

Descriptive Properties
Color / appearance	clear
Mix Ratio	1:1 by volume
	100:85 by weight

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PASINC9091 / 233458

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