Henkel Loctite® ECCOBOND E 1172 A Epoxy

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Henkel Loctite® ECCOBOND E 1172 A Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Tan Cure: Heat Cure Product Benefits: One component Fast cure at low temperatures Low cure temperature Void-free underfill Low CTE Non-anhydride curing chemistry Long pot life Application: Underfill Typical Package Application: Flip chip devices LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Density	1.68 g/cc	0.0607 lb/in³
Filler Content	65 - 68 %	65 - 68 %
Moisture Absorption	1.50 %	1.50 %	Cured, 24-hr boil
Particle Size	<= 20 µm	<= 20 µm
Brookfield Viscosity	17000 cP	17000 cP	Uncured, Spindle 3, speed 5 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	>= 90	>= 90	Cured

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+15 ohm-cm	1.00e+15 ohm-cm
Dielectric Constant	3.52 @Frequency 1e+6 Hz	3.52 @Frequency 1e+6 Hz
Dissipation Factor	0.0042 @Frequency 1e+6 Hz	0.0042 @Frequency 1e+6 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	27.0 µm/m-°C	15.0 µin/in-°F	Cured
Glass Transition Temp, Tg	135 °C	275 °F	Cured
Shrinkage	0.47 %	0.47 %	on Cure

Processing Properties	Metric	English	Comments
Cure Time	3.00 min @Temperature 150 °C	0.0500 hour @Temperature 302 °F	Fast Cure
	6.00 min @Temperature 1235 °C	0.100 hour @Temperature 2255 °F	Standard Cure
	30.0 min @Temperature 100 °C	0.500 hour @Temperature 212 °F	plus 5 minutes @ 135 °C, Low Stress Cure

Descriptive Properties
Extractable Ionic Content (ppm)	<10		Cured, Potassium (K+)
	<15		Cured, Sodium (Na+)
	<35		Cured, Chloride (Cl-)
Pot Life	48 hrs

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PLOCT5073 / 255284

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