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Metal adhesives

Henkel Loctite® ABLESTIK SSP 2020 Conductive Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver

Cure: Heat Cure

Product Benefits:

  • Long work life
  • Good workability
  • Syringe dispensable
  • Stencil printable
  • High electrical conductivity
  • High thermal conductivity
  • High die shear strength
Application: High power die attach

Typical Package Application: High thermal package applications

Key Substrates: Metalized back side die to Ag or Au coated substrates or other metalized leadframes

LOCTITE ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Brookfield Viscosity 19000 cP19000 cPCone & Plate, Speed 5/0.5 rpm
 
Mechanical PropertiesMetricEnglishComments
Tensile Modulus  5.615 GPa
@Temperature 250 °C
814.4 ksi
@Temperature 482 °F
Cured, Elasticity
 6.97 GPa
@Temperature 200 °C
1010 ksi
@Temperature 392 °F
Cured, Elasticity
 8.29 GPa
@Temperature 150 °C
1200 ksi
@Temperature 302 °F
Cured, Elasticity
 9.74 GPa
@Temperature 100 °C
1410 ksi
@Temperature 212 °F
Cured, Elasticity
 12.49 GPa
@Temperature 25.0 °C
1812 ksi
@Temperature 77.0 °F
Cured, Elasticity
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.000048 ohm-cm<= 0.000048 ohm-cmCured, 4-point probe
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity >= 100 W/m-K>= 694 BTU-in/hr-ft²-°FCured
Maximum Service Temperature, Air 260 °C500 °F
 
Processing PropertiesMetricEnglishComments
Working Life >= 1080 min>= 1080 min
Shelf Life 6.10 Month
@Temperature -40.0 °C
6.10 Month
@Temperature -40.0 °F
Uncured
 
Descriptive Properties
Extractable Ionic Content (ppm)<1Cured, Chloride (Cl-)
 <1Cured, Sodium (Na+)
 <1Cured, Potassium (K+)
Shear Strength>4 kg/mm²Die, Pressure Sintering, Ag or Au Surface
 2 kg/mm²Die, Pressureless Sintering, PPF LF
 3 kg/mm²Die, Pressureless Sintering, Ag/Cu leadframe
Thixotropic Index5Uncured, 0.5/5 rpm

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PLOCT5067 / 255278

Metal adhesives

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