Henkel Loctite® ABLESTIK ABP 8068TB Conductive Adhesive

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Henkel Loctite® ABLESTIK ABP 8068TB Conductive Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Liquid Cure: Heat cure Product Benefits: No resin bleed-out One component Good workability Good sintering properties when used on Ag, PPF, Au and Cu substrates High thermal stability Good electrical stability High reliability Solder replacement Application: Semiconductor, Conductive adhesive Filler Type: Silver Typical Package Application: SIP, QFN, LGA, HBLED LOCTITE ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is formulated with a more enhanced resin bleed control than its predecessor LOCTITE ABLESTIK ABP 8068TA. LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power packages. The thermal performance of this material is comparable to that of a solder paste product. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.210 %
Brookfield Viscosity	11500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	650 MPa @Temperature 250 °C	Cured, Dynamic, DMA
	1100 MPa @Temperature 150 °C	Cured, Dynamic, DMA
	12500 MPa @Temperature 25.0 °C	Cured, Dynamic, DMA
	15600 MPa @Temperature -65.0 °C	Cured, Dynamic, DMA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0000070 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	25.0 µm/m-°C	Cured, Below Tg
	103 µm/m-°C	Cured, Above Tg
Thermal Conductivity	100 W/m-K
Glass Transition Temp, Tg	25.0 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	20.0 min	ramp from 25°C to 130°C, hold for 30 to 60 minutes; 15 minutes ramp to 200°C, hold for 120 minutes in N2 or air oven, For the die size <5 x 5 mm
	20.0 min	ramp from 25°C to 130°C, hold for 120 minutes; 15 minutes ramp to 200°C, hold for 120 minutes in N2 or air oven, For the die size >5 x 5 mm
	20.0 min	ramp from 25°C to 130°C, hold for 30 minutes; 10 minutes ramp to 175°C, hold for 60 minutes in N2 or air oven, Alternate Cure Schedule Suitable for Ag, Au and PPF substrates
	1.00 hour @Temperature 200 °C	conventional box oven
Working Life	2.00 hour	Open time
	16.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	0.5	Cured, Potassium (K+)
	1.5	Cured, Sodium (Na+)
	20	Cured, Chloride (Cl-)
Shear Strength	1.2 kg	1 x 1 mm die on PPF
	1.5 kg	1 x 1 mm die on Ag
	1.6 kg	1 x 1 mm die on Cu
	10 kg	3 x 3 mm die on PPF
	10.8 kg	3 x 3 mm die on Cu
	10.9 kg	3 x 3 mm die on Ag
	4.5 kg	2 x 2 mm die on PPF
	5.0 kg	2 x 2 mm die on Ag
	6.5 kg	2 x 2 mm die on Cu
Thixotropic Index	5.5	Uncured, 0.5/5 rpm
Weight Loss (%)	-4	on Cure

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PLOCT5042 / 255253

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