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Ensinger PEI

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A. Schulman BMC T10(14) General Purpose Molding Compound
Categories: Polymer; Thermoset; Polyester, TS; Polyester (Thermoset) - Rigid

Material Notes: BMC T10(14) is a general purpose, low shrink molding compound. Due to the excellent flow and controlled reactivity, BMC T10(14) is well suited for injection, transfer or compression molding of intricate parts. Typical applications are circuit breakers, insulators, bobbins and electrical connectors.

Information provided by Bulk Molding Compounds, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.87 - 2.07 g/ccMolded
Linear Mold Shrinkage 0.0017 - 0.0022 in/in
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 30 - 40
Tensile Strength 8300 - 10300 psi
Flexural Strength 16800 - 20800 psi
Flexural Modulus 1300 - 1500 ksi
Compressive Strength 23500 - 27500 psi
Izod Impact, Notched 5.20 - 7.20 ft-lb/in
 
Electrical PropertiesOriginal ValueComments
Dielectric Strength 351 - 401 V/milshort time
Arc Resistance >= 181 sec
Comparative Tracking Index >= 500 V
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) >= 500 °F
Flammability, UL94 HB
 
Processing PropertiesOriginal ValueComments
Processing Temperature 280 - 330 °F

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