Cookson Group STAYSTIK® 472 Non-Filed Dielectric Interposer Film

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Cookson Group STAYSTIK® 472 Non-Filed Dielectric Interposer Film (discontinued **)
Categories:	Polymer; Adhesive; Film; Thermoplastic
Material Notes:	This thermoplastic adhesive film is designed for use in a variety of electronic applications. It is characterized by its excellent bonding at low process temperatures and extremely low ELASTIC MODULUS (60,000psi). The compliancy of this adhesive allows for the bonding of two materials having large dissimilarities in thermal expansion coefficients. The reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Fully polymerized resin - No "cure" Easily reworkable - No outgassing Bonds in seconds - Not hours or minutes Low modulus reduces stress to bonded materials Information provided by Cookson Electronics
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Mechanical Properties	Original Value	Comments

Modulus of Elasticity	>= 60.0 ksi
Adhesive Bond Strength	>= 2000 psi	Die shear adhesion, at 25°C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+9 ohm-cm

Thermal Properties	Original Value	Comments
Thermal Conductivity	<= 0.250 W/m-K
Maximum Service Temperature, Air	150 °C	Continuous use
	<= 280 °C	Excursion Temperature
Minimum Service Temperature, Air	-65.0 °C	Continuous use
Glass Transition Temp, Tg	>= 25.0 °C

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month	at 25°C

Descriptive Properties
Attach Temperature	125-200°C
Filler Material	None

**
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