UBE UPIA® AT (U-Varnish-A) 1001 Polyimide Film

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UBE UPIA® AT (U-Varnish-A) 1001 Polyimide Film
Categories:	Polymer; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	Polyimide film obtained from "UPIA®" exhibits a high thermal decomposition temperature. Especially, "UPIA®-ST (U-Varnish-S)" has a thermal decomposition temperature above 550°C, so it does not soften, fluidize, or decompose under use temperatures and it is able to be used in high-temperature processes. In addition, the polyimide coating has excellent dimensional stability even at high temperatures. Information provided by UBE Industries, LTD
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Physical Properties	Original Value	Comments

Solids Content	17 - 19 % @Temperature 350 °C, Time 1800 sec
	17 - 19 % @Temperature 350 °C, Time 1800 sec
Viscosity	5000 - 6000 cP @Temperature 30.0 °C	E-type Solution Viscosity in NMP
	5000 - 6000 cP @Temperature 30.0 °C	E-type Solution Viscosity in NMP
Thickness	20.0 microns
	50.0 microns

Mechanical Properties	Original Value	Comments
Tensile Strength	229 MPa	ASTM D882
	238 MPa	ASTM D882
Elongation at Break	92 %	ASTM D882
	99 %	ASTM D882
Tensile Modulus	3.70 GPa	ASTM D882
	3.70 GPa	ASTM D882

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	ASTM D257
	>= 1.00e+14 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+16 ohm	ASTM D257
	>= 1.00e+16 ohm	ASTM D257
Dielectric Strength	7.70 kV/mm	ASTM D149
	10.3 kV/mm	ASTM D149

Thermal Properties	Original Value	Comments
CTE, linear	29.0 µm/m-°C @Temperature 50.0 - 200 °C	Fine linear dilatometer
	33.0 µm/m-°C @Temperature 50.0 - 200 °C	Fine linear dilatometer
Glass Transition Temp, Tg	274 °C	Film property; Dynamic viscoelasticity
	278 °C	Film property; Dynamic viscoelasticity
Decomposition Temperature	>= 550 °C

Descriptive Properties
5% Weight Reduction Temp. (°C)	592	TGA. Film property
	599	TGA. Film property
Chemical Resistance Elongation Retention (%)	100	Ethanol. Thickness: 20µm. 30°C, 24h Dipping.
	102	Trichloroethylene. Thickness: 20µm. 30°C, 24h Dipping.
	107	N-methyl-2-pyroridon. Thickness: 20µm. 30°C, 24h Dipping.
	108	Glacial acetic acid. Thickness: 20µm. 30°C, 24h Dipping.
	81	10% sodium hydroxide. Thickness: 20µm. 30°C, 24h Dipping.
	82	10% hydrochloric acid. Thickness: 20µm. 30°C, 24h Dipping.
	84	Xylene. Thickness: 20µm. 30°C, 24h Dipping.
	89	Methyl ethyl ketone. Thickness: 20µm. 30°C, 24h Dipping.
	90	Chloroform. Thickness: 20µm. 30°C, 24h Dipping
	90	m-Cresol. Thickness: 20µm. 30°C, 24h Dipping.
	91	2% sodium hydroxide. Thickness: 20µm. 30°C, 24h Dipping.
	94	10% sulfuric acid. Thickness: 20µm. 30°C, 24h Dipping.
	96	Methylene chloride. Thickness: 20µm. 30°C, 24h Dipping.
Chemical Resistance Strength Retention (%)	82	10% sodium hydroxide. Thickness: 20µm. 30°C, 24h Dipping.
	88	Chloroform. Thickness: 20µm. 30°C, 24h Dipping
	89	Ethanol. Thickness: 20µm. 30°C, 24h Dipping.
	90	m-Cresol. Thickness: 20µm. 30°C, 24h Dipping.
	91	Glacial acetic acid. Thickness: 20µm. 30°C, 24h Dipping.
	91	10% hydrochloric acid. Thickness: 20µm. 30°C, 24h Dipping.
	92	Methyl ethyl ketone. Thickness: 20µm. 30°C, 24h Dipping.
	93	10% sulfuric acid. Thickness: 20µm. 30°C, 24h Dipping.
	93	Trichloroethylene. Thickness: 20µm. 30°C, 24h Dipping.
	95	Methylene chloride. Thickness: 20µm. 30°C, 24h Dipping.
	98	N-methyl-2-pyroridon. Thickness: 20µm. 30°C, 24h Dipping.
	99	2% sodium hydroxide. Thickness: 20µm. 30°C, 24h Dipping.
	99	Xylene. Thickness: 20µm. 30°C, 24h Dipping.
Heat Treatment Highest Temp.	350
	350

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PUBD9858 / 287321

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