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Metal adhesives

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Master Bond EP30LTE Low Thermal Expansion, Dimensionally Stable Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • Room temperature curing
  • Low viscosity
  • Low shrinkage upon cure
  • Very low coefficient of expansion
  • Superior dimensional stability
  • Serviceable from -100°F to +250°F
Product Description: Master Bond EP30LTE is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE). Also noteworthy is its superior dimensional stability. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. To optimize the properties, it is recommended to cure at room temperature for 12-24 hours, followed by a post cure of a few hours at 150-200°F. The CTE is in the range of 15-18 x 10-6 in/in/°C; markedly lower than other systems. Additionally, it has good thermal conductivity and is highly electrically insulative. Its linear shrinkage upon curing is exceptionally low, less than 0.01%. EP30LTE bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of -100°F to +250°F. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with dimensional stability is desirable.

Product Advantages:

  • 100% reactive, contains no diluents or solvents
  • Very low shrinkage upon cure
  • Lower viscosity; good flow properties — ideal for small to moderate sized castings
  • Exceptionally low thermal expansion coefficient: about 15-18 x 10-6 in/in/°C
  • Good thermal conductivity while still electrically insulative
  • Superior dimensional stability

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 290 - 500 cPPart B
 25000 - 55000 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85 - 90
Tensile Strength 5000 - 6000 psi
Tensile Modulus 500000 - 550000 psi
Compressive Strength 24000 - 26000 psi
Adhesive Bond Strength 1000 - 1200 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 4.5
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 15.0 - 18.0 µm/m-°C
Thermal Conductivity 0.870 - 1.15 W/m-K
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -100 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 93.3 °C
 48.0 - 72.0 hour
@Temperature 23.9 °C
Working Life 40.0 - 70.0 minAfter mixing, 100 g batch
Shelf Life 3.00 - 6.00 Month
@Temperature <=23.9 °C
in original, unopened containers
 
Descriptive Properties
Mixing Ratio10:1 by weightParts A to B

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PMASTM863 / 185456

Metal adhesives

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