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Rulon Bearings

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Aptek 2120 PMF Low modulus urethane staking compound
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: Premixed-frozen, low modulus urethane staking compound
APTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the staking of electrical/electronic components to printed circuit boards. APTEK 212-PMF is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. APTEK 2120-PMF is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion; superior to silicones.

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 0.980 g/ccASTM D1475
Viscosity 188000 cPASTM D1824
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 63Cured property; ASTM D2240
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 350 V/mil
@Thickness 0.127 mm
Cured; ASTM D149
Dissipation Factor 0.024
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesOriginal ValueComments
Glass Transition Temp, Tg -60.0 °CCured property; JMTP P-200
Flash Point >= 150 °CASTM D92
 
Processing PropertiesOriginal ValueComments
Processing Temperature 85.0 °CCure 5 hrs
 100 °CCure 3 hrs
 125 °CCure 1.5 hrs

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PAPTEK24 / 24186

Aluminum Castings

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