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Chemically Resistant adhesives

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Rogers Corporation LoPro™ RO4730 Antenna Grade Non-PTFE Laminate
Categories: Polymer; Thermoset

Material Notes: RO4730 LoPro Antenna Grade Laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. The resin systems of RO4730 dielectric materials are designed to provide the necessary properties for ideal antenna performance.

Features:

  • Low loss dielectric with low profile foil
  • Unique filler / closed microspheres
  • Low Z-Axis CTE and high Tg
  • Low TCDk
  • Specially formulated thermoset resin system/filler
  • Environmentally friendly - Halogen free, Lead free process compatible and RoHS compliant

Benefits:

  • Reduced PIM
  • Low insertion loss
  • Match DK to 3.0 materials
  • Low density/lightweight - ~ 30% lighter than PTFE/glass
  • Design flexibility
  • Automated assembly compatible
  • Consistent circuit performance
  • Ease of fabrication
  • PTH process capability

Information provided by Rogers Corporation.

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Physical PropertiesOriginal ValueComments
Density 1.45 g/ccASTM D792
Moisture Absorption at Equilibrium 0.13 %IPC-TM-650 2.6.2.1; ASTM D570
Thickness 30.7 - 60.7 milRange of Thicknesses Available
 
Mechanical PropertiesOriginal ValueComments
Peel Strength 7.70 pliCopper; 1 oz. LoPro; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.40e+19 ohm-cm
@Thickness 0.762 mm
Condition A; IPC 2.5.17.1
Surface Resistance 5.50e+18 ohm
@Thickness 0.762 mm
Condition A; IPC 2.5.17.1
Dielectric Constant 2.92 - 3.08
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dielectric Strength 620 V/milZ Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0023
@Frequency 2.50e+9 Hz
Z direction; IPC-TM-650 2.5.5.5
 0.0033
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°CY-Direction; IPC-TM-650 2.4.41
 19.0 µm/m-°CX-Direction; IPC-TM-650 2.4.41
 40.0 µm/m-°CZ-Direction; IPC-TM-650 2.4.41
Thermal Conductivity 0.520 W/m-K
@Temperature 80.0 °C
ASTM C518
Glass Transition Temp, Tg >= 280 °CTMA; ASTM D3850
Decomposition Temperature 441 °CTGA; ASTM D3850
 
Descriptive Properties
Dimensional Stability-0.14 mm/mX direction; IPC-TM-650, 2.4.39A
 -0.145 mm/mY direction; IPC-TM-650, 2.4.39A
PIM< -154 dBc[2]
Thermal Coefficient of Dielectric Constant23 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C; Z-Direction

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PROGA961 / 138401

Chemically Resistant adhesives

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