Henkel Loctite® HHD 3607BK Adhesive

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Henkel Loctite® HHD 3607BK Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Chemical Type: Reactive Polyurethane Appearance: Black Cure: Solidification and Moisture Odor: Slight Components: One part - requires no mixing Product Benefits: Jettable PUR Fast curing High impact resistance High adhesion strength Application: Device assembly, Structural bonding LOCTITE HHD 3607BK is a reactive hot-melt adhesive based on polyurethane prepolymers. This product is formulated with a viscosity suitable for robotic jetting applications along with a suitable open time for automatic assembly line processing. Good initial strength is realized immediately after the material solidifies in the bondline. LOCTITE HHD 3607BK material exhibits superior toughness when fully cured and will not remelt. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	6500 cP	Thermosel, 110 °C, Spindle 27

Mechanical Properties	Original Value	Comments
Tensile Strength	2.00 MPa	cured 23ºC, 60% relative humidity for 2 hours: PBT/40% Glass filler substrate
	2.10 MPa	cured 23ºC, 60% relative humidity for 2 hours: PC/20% Glass filler substrate
	4.80 MPa	cured 23ºC, 60% relative humidity for 24 hours: PBT/40% Glass filler substrate
	5.20 MPa	cured 23ºC, 60% relative humidity for 24 hours: PC/20% Glass filler substrate
	29.0 MPa	Cured
Elongation at Break	880 %	Cured
Tensile Modulus	60.0 MPa	Cured
Shear Strength	2.70 MPa	Lap, Hot Strength @ 55ºC: PBT/40% Glass filler substrate
	3.80 MPa	Lap, Hot Strength @ 55ºC: PC/20% Glass filler substrate
	6.50 MPa	Lap, Cured 24 hours @ 23ºC, 60% relative humidity: PBT/40% Glass filler substrate
	8.90 MPa	Lap, PBT/40% Glass filler substrate, (**) After Thermal Cycling
	9.60 MPa	Lap, PBT/40% Glass filler substrate, (*) After HTHH
	11.2 MPa	Lap, Cured 24 hours @ 23ºC, 60% relative humidity: PC/20% Glass filler substrate
	12.6 MPa	Lap, PBT/40% Glass filler substrate, (***) After High Temperature Resistance
	15.6 MPa	Lap, PC/20% Glass filler substrate, (*) After HTHH
	17.6 MPa	Lap, PC/20% Glass filler substrate, (**) After Thermal Cycling
	22.8 MPa	Lap, PC/20% Glass filler substrate, (***) After High Temperature Resistance
Impact Test	1.19e+7 J	Dupont, cured 3 days @ 23ºC, 60% relative humidity: PBT/40% Glass filler + MgAl substrate
	2.33e+7 J	Dupont, cured 3 days @ 23ºC, 60% relative humidity: PC/20% Glass filler + MgAl substrate

Optical Properties	Original Value	Comments
Transmission, Visible	0.38 % @Thickness 0.200 mm, Wavelength 550 nm	Cured

Processing Properties	Original Value	Comments
Cure Time	20.0 - 30.0 min @Temperature 110 °C	Preheating Schedule
Working Life	>= 2.00 min	Open Time

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PLOCT5117 / 255328

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