Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	STAYCHIP 3090 is a highly filled, high reliability capillary underfill designed for high productivity flip applications. This material merges excellent stability with fast cure speed, fast flow times, and exceptional reliability performance. The reactivity of Staychip 3090 allows shipment of material in bulk quantities up to 20 ounce cartridges and storage in a conventional refrigerator at 5°C. Features: 5°C storage Long pot life Non-anhydride formulation Capable to package in large containers to minimize syringe change out Excellent adhesion (even after exposure to high humidity, pressure and temperature) Fast, efficient flow properties High filler loading while maintaining fast flow properties Exceptional reliability in JEDEC testing Proprietary filler technology Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.50 g/cc	ASTM D 1475-60
Filler Content	55 %
Moisture Absorption at Equilibrium	1.0 %	2 hour boil
Particle Size	<= 11 µm
Brookfield Viscosity	5100 cP	Brookfield #51 at 10 RPM
Storage Temperature	<= 5.00 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	ASTM D 2240
Fracture Toughness	2.94 MPa-m½

Thermal Properties	Original Value	Comments
CTE, linear	38.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	130 µm/m-°C @Temperature 20.0 °C	Alpha 2
Glass Transition Temp, Tg	99.0 °C	By DSC
Flash Point	>= 201 °C	ASTM D 93-85

Processing Properties	Original Value	Comments
Pot Life	10080 min
Shelf Life	>= 6.00 Month	at 5°C

Descriptive Properties
Appearance	Black
Capillary Flow Time	40 seconds	Flow time @ 100°C, Glass-to-FR4, 0.001in/25micron gap, 0.75" flow
Chemical Type	Epoxy
Storage Modulus	3.48 GPa	ASTM D5023-01

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PPLASK078 / 56368

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message