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Master Bond adhesives

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Selenis SELEKT CD 410 PETG Copolyester for Injection Molding
Categories: Polymer; Thermoplastic; Polyester, TP; Polyethylene Terephthalate (PET); PETG Copolyester

Material Notes: Selenis Selekt CD 410 is a copolyester that is suitable for injection molding applications. From thin wall and intricate parts to thicker cross-sections where toughness is required. Injection molded parts made from Selenis Selekt CD 410 are water-clear and glossy, whilst tough and durable. Thanks to Selenis Selekt CD 410 high dimensional stability, multiple parts products may be assembled with snap-fit connectors, maintaining the strength required to sustain daily wear and tear. Due to the high-flow properties of Selenis Selekt CD 410, complicated shapes can be molded with limited in-mold stress. Selenis Selekt CD 410 is the ideal solution when eye-catching graphics are required, as multiple decorative techniques may be successfully used

Information provided by Selenis.

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Physical PropertiesOriginal ValueComments
Bulk Density 0.730 g/cc
Density 1.28 g/ccASTM D792
Water Absorption <= 0.12 %ASTM D570
Viscosity Test 70 - 74 cm³/gIntrinsic; ISO 1628-5
Linear Mold Shrinkage 0.0020 - 0.0050 cm/cmASTM D 955
ASTM Color <= 1.0b*; ASTM D6290
 >= 68L*; ASTM D6290
 
Mechanical PropertiesOriginal ValueComments
Flexural Strength 60.5 MPaISO 178
Flexural Modulus 1916 MPaISO 178
Charpy Impact Unnotched NB
@Temperature -30.0 °C
ISO 179-1/1eU
 NB
@Temperature 0.000 °C
ISO 179-1/1eU
 NB
@Temperature 23.0 °C
50% RH; ISO 179-1/1eU
Charpy Impact, Notched 5.00 kJ/m²
@Temperature -30.0 °C
ISO 179-1/1eA
 5.00 kJ/m²
@Temperature 0.000 °C
ISO 179-1/1eA
 5.60 kJ/m²
@Temperature 23.0 °C
50% RH; ISO 179-1/1eA
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 66.0 °CISO 75-1/-2
Deflection Temperature at 1.8 MPa (264 psi) 58.8 °CISO 75-1/-2
 
Optical PropertiesOriginal ValueComments
Gloss 166 %60º; ASTM D2457
Transmission, Visible 83 %
@Thickness 5.00 - 6.00 mm,
Wavelength 400 nm
Disk
 85 %
@Thickness 4.00 mm,
Wavelength 400 nm
Disk
 86 %
@Thickness 2.00 - 3.00 mm,
Wavelength 400 nm
Disk
 88 %
@Thickness 1.00 mm,
Wavelength 400 nm
Disk
 88 %
@Thickness 4.00 - 6.00 mm,
Wavelength 440 - 660 nm
Disk
 89 %
@Thickness 1.00 - 3.00 mm,
Wavelength 440 - 660 nm
Disk
 89 %
@Thickness 1.00 - 6.00 mm,
Wavelength 660 - 740 nm
Disk
UV Transmittance 70 %
@Thickness 6.00 mm,
Wavelength 370 nm
Disk
 71 %
@Thickness 5.00 mm,
Wavelength 370 nm
Disk
 75 %
@Thickness 4.00 mm,
Wavelength 370 nm
Disk
 79 %
@Thickness 3.00 mm,
Wavelength 370 nm
Disk
 81 %
@Thickness 2.00 mm,
Wavelength 370 nm
Disk
 85 %
@Thickness 1.00 mm,
Wavelength 370 nm
Disk
 
Processing PropertiesOriginal ValueComments
Melt Temperature 180 - 250 °C
Drying Temperature <= 70.0 °Cto avoid chips sticking together in dryer hopper
 60.0 - 65.0 °C
@Time 21600 - 28800 sec
Moisture Content <= 0.0040 %dried
Dew Point -40.0 °C
 
Descriptive Properties
Particle size320 ± 50 mg/20 chips
Pellet ShapeCylindrical

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PSELE947 / 243445

Rulon Bearings

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