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Master Bond adhesives

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Electrolytic Copper Tough Pitch, strip 427°C (800°F) anneal for 1 hour
Categories: Metal; Nonferrous Metal; Copper Alloy

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Physical PropertiesOriginal ValueComments
Density 8.91 g/cc
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.7 µm/m-°C
@Temperature -4.00 - 149 °C
Thermal Conductivity 392 W/m-K
Melting Point 1083 °C
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 99.9 %
Other 0.060 %
Oxygen, O 0.040 %

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