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Ensinger PEI

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Lord Adhesives Metech 3505 Palladium Silver Conductor Composition
Categories: Polymer; Adhesive

Material Notes: Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide processing parameters and is optimized for use with high speed printing equipment. Fired conductor exhibits high initial and aged adhesion values and readily accepts tin lead and tin lead silver solders.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Viscosity 200000 - 260000 cP
Thickness 12.0 micronsFired
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square 0.020 ohm
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
Adhesion4-5lbs; aged (100 hrs. at 150ºC)
 5-6lbs; initial
Coverage (cm²/gm)70-75Calculated from 50 micron wet film
Line Resolution (microns)150
Silver to Palladium Ratio4:1
Solder Leach Resistance (5 sec. cycles)5Cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds)< 3Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC

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PLORD075 / 86083

Proto3000 – 3D Engineering Solutions

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