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Chemically Resistant adhesives

Parker Chomerics THERM-A-GAP™ GEL T636 Dispensable, Very Low Compression Force, Thermal Gap Filler
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ Gels are highly conformable, pre-cured, single-component compounds. The cross-linked gel structure provides superior long therm thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features/Benefits: Dispensable; Fully cured; Highly conformable at low pressures; No refrigeration, mixing or filler settling issues in storage; Single dispensable TIM can eliminate multiple pad part sizes/numbers; RoHS Compliant and Reworkable

Typical Applications: Automotive electronic control unites (ECUs), engine control, transmission control, braking/traction control; Power conversion equipment; Power supplies and uninterruptible power supplies; Power semiconductors; MOSFET arrays with common heat sinks and Televisions and consumer electronics.

Product Attributes: Superior thermal performance; Solves the toughest heat transfer problems; Low deflection force required and Minimal stress on components

Information provided by Chomerics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.20 g/cc1.20 g/ccASTM D792
Thickness 0.380 microns0.0150 milBondline
Deformation  6.0 %
@Thickness 2.54 mm,
Pressure 0.00689 MPa
6.0 %
@Thickness 0.100 in,
Pressure 1.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 23 %
@Thickness 2.54 mm,
Pressure 0.0138 MPa
23 %
@Thickness 0.100 in,
Pressure 2.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 25 %
@Thickness 2.54 mm,
Pressure 0.0207 MPa
25 %
@Thickness 0.100 in,
Pressure 3.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 43 %
@Thickness 2.54 mm,
Pressure 0.0276 MPa
43 %
@Thickness 0.100 in,
Pressure 4.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 48 %
@Thickness 2.54 mm,
Pressure 0.0345 MPa
48 %
@Thickness 0.100 in,
Pressure 5.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
Outgassing - Total Mass Loss 0.40 %0.40 %ASTM E595
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmASTM D257
Dielectric Constant 4.0
@Frequency 1e+6 Hz
4.0
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 5.00 kV/mm127 kV/inASTM D149
Dissipation Factor 0.0030
@Frequency 1e+6 Hz
0.0030
@Frequency 1e+6 Hz
Chomerics
 
Thermal PropertiesMetricEnglishComments
CTE, linear 400 µm/m-°C222 µin/in-°FASTM E831
Specific Heat Capacity 0.900 J/g-°C0.215 BTU/lb-°FASTM D1269
Thermal Conductivity 2.40 W/m-K16.7 BTU-in/hr-ft²-°FASTM D5470
Maximum Service Temperature, Air 200 °C392 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
Flammability, UL94 V-0V-0
 
Processing PropertiesMetricEnglishComments
Shelf Life 18.0 Month18.0 MonthFrom date of manufacture; Chomerics
 
Descriptive Properties
ColorYellow
Flow Rate8 cc/min30cc taper tip, 0.13" orifice, 90 psi; Chomerics

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PCHOME302 / 131012

Chemically Resistant adhesives

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