Henkel Hysol MA 560 Core Splice Adhesive

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Henkel Hysol MA 560 Core Splice Adhesive
Categories:	Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	A modified epoxy, low density (24-25 psf) foaming film adhesive capable of expanding 2.5 times the original thickness. Cures at 250°F / 121°C or 350°F / 177°C and is designed for service at temperatures from -67°F / -55°C to 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance.
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Physical Properties	Metric	English	Comments

Storage Temperature	-18.0 °C	-0.400 °F

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	5.90 MPa @Temperature 121 °C	856 psi @Temperature 250 °F	tube shears
	8.20 MPa @Temperature 25.0 °C	1190 psi @Temperature 77.0 °F	tube shears

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	177 °C	351 °F

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 121 °C	1.00 hour @Temperature 250 °F
	60.0 min @Temperature 177 °C	1.00 hour @Temperature 351 °F

Descriptive Properties
Out-Time (days)	10		at 32°C
	30		at 25°C

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PHENK868 / 146873

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